GaN (Gallium Nitride) is the promising compound semiconductor material for the next generation power device technology with its high electron mobility character. VIS' 8" GaN technology is developed on the proprietary engineering substrates with better thermal/CTE matching and high reliability robustness.

The device's outstanding figure of merit (FOM) surpasses silicon-based transistor under high switching frequency that makes the GaN becomes the optimum solutions for high power efficiency products in high performance computing and electrical vehicle applications.

VIS offers the competitive embedded flash (eFlash) technology ranging from 0.18um to 0.11um for MCU, like battery management, motor driver, smart lighting and smart card, in consumer, computer, communication and industrial markets.

In addition, VIS' eFlash technology provides optional feature of high voltage (HV) devices up to 40V that allows single chip design by integrating MCU and HV analog circuits and pre-gate driver design.

Sensors

VIS offers various technologies for optical sensors, magnetic sensors and thermal sensors.

VIS' 0.18um optical sensor technology is with high quantum efficiency (QE) for the wavelength spectrum from visible light to near infrared (NIR). The technology is suitable for the application like proximity sensors (PS) and ambient light sensors (ALS) and optical fingerprint sensors in mobile phones, notebooks, tablets and true wireless stereo (TWS) devices.

VIS' magnetic sensors focus on anisotropic magneto-resistance (AMR) technology with better magnetic resolution, high cross axis sensitivity and smaller driving current comparing to the traditional hall sensor technology. VIS' AMR technology is suitable for e-compass, angle sensors, encoders, and low power switches in mobile devices, industrial and automotive applications.

VIS' thermal sensor technology available in 0.25um and 0.18um geometry for the application like personal health monitors, wearables, as well as automotive and industrial devices.

MEMS

VIS provides the best-fit micro electro mechanical system (MEMS) technologies for diversified applications like accelerometers, gyroscopes, ultrasonic fingerprint sensors touch sensors, microphone and timing resonators in smartphones, wearables and wireless earbuds.

In addition to the MEMS technology, VIS offers monolithic CMOS and MEMS integration solution for MEMS SOC like piezoelectric micromachined ultrasonic transducer (PMUT) applications.

Power semiconductor device has broad ranges of Discrete products used in the voltage regulators, rectifiers, inverters, amplifiers, and other power supply devices in communication, consumer, computing, industrial, and automotive applications.

VIS provides foundry's most competitive 8" Discrete process technologies, ranging from 12V~300V for power mosfet and 600V~1700V IGBT, and diodes. VIS' diversification of business models, including phase-in and joint development programs, provides the technology solutions that are not just to retain customer's proprietary competitiveness but also to support customer for further technology performance enhancement.

In addition to the front-end wafer process technology, VIS provides specific discrete back-end turnkey services that simplify customers business flow with one-stop-shop. Please refer to “Backend Services" for further details.

Power semiconductor device has broad ranges of Discrete products used in the voltage regulators, rectifiers, inverters, amplifiers, and other power supply devices in communication, consumer, computing, industrial, and automotive applications.

VIS provides foundry's most competitive 8" Discrete process technologies, ranging from 12V~300V for power mosfet and 600V~1700V IGBT, and diodes. VIS' diversification of business models, including phase-in and joint development programs, provides the technology solutions that are not just to retain customer's proprietary competitiveness but also to support customer for further technology performance enhancement.

In addition to the front-end wafer process technology, VIS provides specific discrete back-end turnkey services that simplify customers business flow with one-stop-shop. Please refer to “Backend Services" for further details.

VIS offers 8" foundry's most comprehensive and competitive power management process technologies including Bipolar-CMOS-DMOS (BCD), Ultra High Voltage (UHV) and Silicon-on-Insulator (SOI).

BCD

VIS' BCD technology provides wide spectrum of voltage rating from 5V to 120V with geometry from 0.5µm to 0.11µm. VIS' BCD technology features the most competitive low Rsp performance for high efficiency, high current and form factor limitation applications in mobile, consumer and computing markets; and high quality of robustness and reliability for automotive and industrial applications.

In addition, VIS' BCD technology also provides wide variety of embedded Non-Volatile Memory (eNVM) IPs, including One-Time-Programing (OTP) and Multiple-Time-Programing (MTP) IPs, for smart power management design like USB power delivery, quick charger, wireless charger, smart lighting and motor driver applications. Moreover, VIS also offers ultra-high voltage insulator module (>5KV) on selected BCD technology for optocoupler application.

UHV

VIS offers the best-in-class 0.5um UHV technology with voltage rating from 200V to 700V for green energy applications. VIS' UHV technology features high reliability devices and the best fit processes for solid state lighting, AC/DC adapter and motor driver applications.

SOI

VIS offers BCD-on-SOI process with voltage rating from 10V to 200V and geometry from 0.5um to 0.15um. The SOI process provides the ultimate isolation solution for noise and temperature sensitive design in automotive, medical and industrial applications. In addition, VIS' BCD-on-SOI provide high precision thin film resistor (SiCr) that enables high precision analog feature design.